High-Purity Boron Nitride Ceramic Saggars and Containers – Wear-Resistant & Thermally Stable

• Customization: Available
• Application: Aerospace, Electronics, Refractory, Semiconductor
• Grain Size: <100nm
• Model NO.: 200*200*100
• Purity: 99%
• Type: Ceramic Plate
• Main Material: Andalusite, Alumina
• Working Temperature: 850ºC
• Flatness: <0.5mm
• Colour: Gray-Black
• V Shape Angle: Can Be Customized
• Transport Package: Wooden Boxes
• Specification: 100× 100× 3 mm, 150*150*3.
• Trademark: Moat City
• Origin: China
• HS Code: 6903900090
• Production Capacity: 1000000

Product Description

Boron Nitride Saggars [MH-BNC995H - BoronNitride]

Product Features

Introducing our high-performance Boron Nitride (BN) Products, designed for high-temperature applications and exceptional durability:

• High Purity and Density: Featuring >99.5% BN purity and a density of 1.95±0.05 g/cm³, ensuring superior performance in extreme conditions.
• Exceptional Thermal Properties: With a maximum operating temperature of 850°C in air and >2000°C in inert atmospheres, the material is perfect for high-temperature applications.
• Superior Mechanical Strength: The flexural strength of 22 MPa and hardness of 4 kg/mm² ensure that these products maintain structural integrity under stress.
• No Binder Additives: Our process excludes the use of binders, ensuring the stability and purity of the final product.

Applications

Boron Nitride products are ideal for:

• High-Purity Crucibles: Suitable for molten metal handling in extreme temperature environments.
• Crucible and Bearing Plates: Designed for the sintering of nitride phosphors, silicon nitride, aluminum nitride, and other ceramics and powders.
• High-Temperature Furnace Components: Including electrode insulation parts and protective tubes for use in extreme thermal conditions.
• Boron Nitride Insulation: Used in polysilicon ingot furnaces for insulation assemblies.

Technical Highlights

• Cold Isostatic Pressing and Hot Pressing Sintering: Utilizes advanced two-way pressure sintering technology to create highly dense and durable materials.
• Low Thermal Expansion: Coefficient of thermal expansion is controlled between -1 to 1.2 (10/K), ensuring dimensional stability in temperature variations.
• High Thermal Conductivity: With thermal conductivity ranging from 50-70 W/mK, these products efficiently manage heat, ensuring consistent performance in high-temperature environments.

Technical Parameters

BN Purity (%)	>99.5
Other Components	No
Density (g/cm³)	1.95±0.05
Hardness (kg/mm²)	4
Porosity (%)	<15
Flexural Strength (MPa)	22
Coefficient of Thermal Expansion (10/K)	-1~1.2
Thermal Conductivity (W/mK)	50-70
Max. Operating Temperature in Air (°C)	850°C
Max. Operating Temperature in Inert Atmosphere (°C)	>2000°C
Room Temperature Resistivity (Ω•cm)	10¹