



Recrystallized Silicon Carbide Plate [MH-XG-R.SiC99]
Product Features
We proudly introduce our high-performance Recrystallized Silicon Carbide (ReSiC) plates, meticulously engineered for the most demanding high-temperature industrial applications, providing exceptional performance in industrial furnaces and heat treatment processes:
- Outstanding Heat Resistance: ReSiC plates can withstand extreme temperatures up to 1650°C, making them ideal for high-temperature industrial furnaces, atmosphere furnaces, and various heat treatment processes. They exhibit excellent thermal stability and resistance to thermal shock in these high-heat environments.
- Superior Strength and Durability: With a high purity of over 99% silicon carbide, these plates deliver exceptional structural strength and long-lasting durability in harsh working conditions. Their low contamination risk, combined with outstanding oxidation and corrosion resistance, ensures long-term stability and extended service life, significantly reducing maintenance and downtime costs in challenging industrial environments.
- Low Porosity and High Density: Featuring an open porosity of less than 15% and a bulk density ranging from 2.65 to 2.75 g/cm³, ReSiC plates provide excellent mechanical strength under high-stress and high-wear conditions. The low porosity also results in a smoother surface and reduced wear, contributing to enhanced overall durability and performance under extreme temperature conditions.
Applications
- High-Temperature Industrial Furnaces: ReSiC plates are the ideal choice for various high-temperature industrial furnaces, particularly in applications requiring material stability and reliability under extreme heat, such as metal smelting, ceramic firing, glass manufacturing, and other high-temperature processes.
- Heat Treatment Processes: In the heat treatment of metals, ceramics, and other materials, ReSiC plates offer superior thermal stability, mechanical strength, and durability. Their excellent resistance to thermal shock makes them a key component in efficient heat treatment production lines, helping to increase production efficiency and extend equipment life.
Technical Highlights
- Thermal Conductivity: With thermal conductivity of 35-36 W/m•K at 1200°C, the plates efficiently manage heat transfer, reducing the risk of localized overheating.
- High Flexural Strength: At 1200°C, the flexural strength ranges from 90~120 MPa, providing excellent mechanical stability under extreme thermal stress.
- Controlled Thermal Expansion: The thermal expansion rate of 4.6 x 10 at 1000°C ensures dimensional stability, reducing the risk of cracking or deformation during thermal cycling.
Technical Parameters
Parameter |
Value |
SiC Content (%) |
>99 |
Thermal Expansion Rate (x10 at 1000°C) |
4.6 |
Hardness at 20°C (Kg/mm²) |
1800-2000 |
Thermal Conductivity at 1200°C (W/m•K) |
35-36 |
High Temperature Flexural Strength (1200°C•0.5h) (MPa) |
90~120 |
Suggested Working Temperature (°C) |
<1650 |
Open Porosity (%) |
<15 |
Bulk Density (g/cm³) |
2.65~2.75 |
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